@Stephanie Williams the via stitching debate is real and honestly both camps have a point depending on what they're actually trying to achieve — but for a front-end with external amplifiers like what's on the MultiNav Pro+, you don't want to be in the "barely bother" camp.
The short version: stitching vias matter most at the boundary between your RF section and everything else, not uniformly across the whole board. Dense stitching every 2-3mm around the antenna keep-out and along the edges of your RF ground pour is where it actually earns its keep — that's where you're killing ground loops and preventing your digital return currents from wandering through your RF ground reference. Inside a solid poured ground plane away from those boundaries, you can relax a bit.
The thing that trips people up with higher-power front-ends more than via density is actually the ground plane void situation under the RF trace routing. Any slot or void that your RF signal path runs across — even from a nearby connector cutout or a via field that got placed without thinking — can create an impedance discontinuity that'll mess with your return loss more than a few missing stitching vias will. Keep the ground plane absolutely unbroken under any 50-ohm trace runs to the antenna connector.
The other thing worth checking: make sure your decoupling for the PA supply is as close as physically possible to the power pins, with the shortest possible trace back to the ground plane. PA supply noise is one of those things that kills real-world range in ways that are hard to debug later.
